upHere UP1 Elite TC4C ARGB Air CPU Cooler

The upHere UP1 Elite TC4C ARGB Air CPU Cooler features premium infinity-mirror ARGB aesthetics. This CPU Cooler delivers 240W TDP cooling capacity using four Φ6mm heat pipes and a single high-airflow 130mm fan with a hydraulic bearing for reliable, quiet daily operation. This upHere UP1 Elite TC4C ARGB CPU Cooler supports all major Intel and AMD socket platforms and features GPU-Isolation Air Duct Technology for optimized and focused CPU thermal management.

Infinity Mirror ARGB Aesthetics

The upHere UP1 Elite TC4C ARGB Air CPU Cooler features a stunning infinity mirror top cover that creates mesmerizing and deeply layered ARGB lighting effects inside any windowed PC case. The customizable ARGB illumination transforms the cooler into a visual centerpiece that elevates the overall aesthetic quality of any gaming or enthusiast build. This upHere UP1 Elite TC4C CPU Cooler delivers both function and form, combining thermal performance with premium visual design that rivals dedicated RGB showcase components.

GPU-Isolation Air Duct Technology

The upHere UP1 Elite TC4C ARGB CPU Cooler uses innovative GPU-Isolation Air Duct Technology that creates an independent airflow channel to prevent GPU heat from interfering with CPU cooling performance. This dedicated airflow separation maintains focused and efficient thermal management around the CPU area without mixing hot air rising from the graphics card. The result is a consistently lower CPU temperature during demanding gaming and creative workloads where both the CPU and GPU generate significant heat simultaneously.

Four Heat Pipes and Thermal Capacity

The upHere UP1 Elite TC4C CPU Cooler uses four Φ6mm heat pipes that efficiently draw heat away from the CPU surface and distribute it evenly across the aluminum fin stack for consistent thermal dissipation. This four-pipe configuration supports a robust 240W TDP rating, making the cooler more than capable of handling mainstream and high-performance desktop processors under sustained gaming and productivity workloads. The tower design maximizes the fin surface area available for heat exchange and a single fan to cool the processor effectively without requiring a dual-fan push-pull configuration.